HVLP4 Copper Foil Shortage Threatens Global CCL Market Growth
The global market for Copper Clad Laminate (CCL) is expected to reach USD 47 billion by 2030, up from USD 19 billion in 2025, according to Morgan Stanley estimates. This represents a 20% compound annual growth rate, higher than the previously expected range of USD 35-40 billion.
The demand for CCL is driven by AI and data centers, which account for nearly two-thirds of the total share by 2030. However, there is a tight supply chain in the industrial sector, particularly with HVLP4 copper foil, which is used in high-speed AI servers and network boards.
A shortage of HVLP4 copper foil is expected to reach 31% in 2027 and 20% in 2028. This is due to the low yield rate and long certification cycle for this material. The leading mainland copper foil manufacturers are struggling to keep up with demand, with Defu Technology shipping only about 70 tons of HVLP4 in August.
The prices of electronic cloth and CCL have already reflected the supply and demand dynamics, with some companies increasing their prices by as much as 30% or more. The profit distribution is also uneven, with a few large enterprises holding a significant share of the market.