Stocks
JPMorgan Chase & Co. Issues Corporate Bond with 5.1% Coupon Rate
JPMorgan Chase & Co. issued a corporate bond with a coupon rate of 5.1% and a maturity date of August 16, 2029.
The bond is traded on the FINRA exchange under the ticker symbol JPM5869358.
The next payment for this bond is scheduled for August 17, 2026, with an interest rate of 5.1% and a coupon amount of $25.50 per period.
The payments are made semi-annually, and the bond's yield to maturity (YTM) is not specified in the source.