JPMorgan Chase & Co. Issues Corporate Bond with 5.50% Coupon Rate
JPMorgan Chase & Co. has issued a corporate bond with a coupon rate of 5.50% and a maturity date of August 31, 2029.
The next payment is scheduled for August 31, 2026, and will be semi-annual.
The bond's current status is active, but it has been redeemed in the past.