JPMorgan Chase Issues 5.50% Bond Due in 2039

JPMorgan Chase & Co., a major financial holding company, has issued a bond with a coupon rate of 5.50% and a maturity date of August 11, 2039.

The bond, identified as JPM6477118, was issued on August 11, 2026, with an outstanding amount of $1,000.00 USD at face value.

The bond's term to maturity is 13 years, and it operates within the Finance sector under the Major Banks industry.