JPMorgan Chase Issues 5.75% Bond Due 2038
JPMorgan Chase & Co. has issued a bond with a coupon rate of 5.75% and a maturity date of August 31, 2038. The bond is denominated in USD with a face value of $1,000 and a minimum denomination of $1,000.
The bond information shows that JPMorgan Chase & Co. is the issuer, and the sector is finance, industry is major banks. The issue date is August 31, 2026, and the ISIN is US48130KJP30.