JPMorgan Chase Issues 5.8% Coupon Corporate Bond Due 2050
JPMorgan Chase & Co. has issued a corporate bond with a coupon rate of 5.8% and a maturity date of July 29, 2050. The next interest payment is scheduled for August 2, 2027.
The bond's payments are annual, with the issuer paying out $58 per year to investors based on the current coupon rate. This represents an effective yield-to-maturity (YTM) of 5.8%.
According to TradingView data, the bond's recent ratings include a S&P rating of 700 and a Fitch rating of 720, both dated before May 29, 1753, which is equivalent to June 18, 2007.