JPMorgan Chase Issues Bond with 2.25% Coupon Rate and 13 Semi-Annual Payments

JPMorgan Chase & Co., one of the largest banks in the United States, has issued a bond with a 2.25% coupon rate and a maturity date of November 26, 2028. The bond is listed on the FINRA exchange under the ticker JPM5188865.

The current coupon rate is 2.25%, which means investors will receive an interest payment of $11.25 per semi-annual period, starting from the next payment date on November 27, 2026.

According to TradingView's bond data, the bond has a total of 13 semi-annual payments until maturity, with each payment occurring every six months.

The bond's coupon rate is fixed at 2.25%, which means it will not change over time, unlike floating-rate bonds that adjust their interest rates based on market conditions.