JPMorgan Chase Issues Bond with 5.38% Coupon Rate

JPMorgan Chase & Co., a leading financial holding company, has issued a bond with key metrics that highlight its investment banking and financial services business.

The JPM6496995 Bond Profile reveals that the issue date is August 31, 2026, and it will mature on August 31, 2034. The face value of this bond is $1,000 USD, with a minimum denomination of $1,000 USDC.

The coupon rate for this bond is 5.38%, indicating the annual interest payment made by JPMorgan Chase & Co. to its investors. This information is crucial for investors and financial analysts who are interested in understanding the company's debt obligations and investment opportunities.