JPMorgan Chase Issues Bond with August 2026 Issue Date

JPMorgan Chase & Co., a financial holding company, has issued a bond with key metrics that are now publicly available. The JPM6496979 Bond Profile lists the issuer as JPMorgan Chase & Co., with an issue date of August 31, 2026 and a maturity date of August 30, 2041. The face value of this bond is $1,000 USD, with a minimum denomination also set at $1,000 USD.

The bond carries a coupon rate of 5.80%, which reflects the interest paid to investors for holding the bond until maturity. This information provides transparency into the financial dealings of JPMorgan Chase & Co., allowing market participants and investors to access important data on this specific bond issue.