JPMorgan Chase Issues Callable Corporate Bond with 5.2% Coupon Rate

JPMorgan Chase & Co. has issued a corporate bond with a coupon of 5.2% and a maturity date of November 30, 2033. The bond, identified as JPM6081599, is listed on the FINRA exchange.

The redemption details for this bond show that it is callable, meaning it can be redeemed early by the issuer. According to the data provided, the next call date is October 31, 2024, and the notice period is five days.

The outstanding amount of the bond is $4.5 million, and the redemption type is 'callable.' The sinking fund schedule for this bond may impact decisions related to its redemption.