JPMorgan Chase Issues Corporate Bond with 4.8% Coupon Rate
JPMorgan Chase & Co. issued a corporate bond with a coupon rate of 4.8% and a maturity date of February 13, 2036. The bond's next payment is scheduled for February 16, 2027.
The bond's interest payments are annual, with the first payment due on November 17, 2023, at $48.00 per unit.
The issuer has a fixed coupon listing, which means that the interest rate will remain the same throughout the bond's life.