JPMorgan Chase Issues Corporate Bond with 5.3% Coupon Rate
JPMorgan Chase & Co. has issued a corporate bond with a coupon rate of 5.3% and a maturity date of June 22, 2035.
The bond's interest payments are scheduled to take place annually, with the next payment set for June 23, 2027.
A coupon or nominal yield is the interest rate paid on a bond, in this case, 5.3%.