Stocks
JPMorgan Chase Issues Corporate Bond with 5.30% Coupon Rate
JPMorgan Chase & Co. has issued a corporate bond with a coupon rate of 5.30% and a maturity date of December 21, 2033.
The bond, identified as JPM5720798, is listed on the FINRA platform and carries a credit rating that is not specified in the provided information.
According to the data, the next interest payment for this bond is scheduled for December 21, 2026. Investors can view more coupon data, including rates and payments, by checking the 'Coupon Payout Schedule' section of the JPM5720798 bond profile on TradingView.