JPMorgan Chase Issues Corporate Bond with 5.43% Coupon Rate
JPMorgan Chase & Co., one of the largest financial institutions in the US, has issued a corporate bond with a coupon rate of 5.43%. The bond, identified as JPM6481665, is set to mature on August 14, 2034.
The next interest payment for this bond is scheduled for August 16, 2027. According to the data provided by TradingView, the current coupon rate of 5.43% is based on the nominal yield paid on the bond.
This information is part of a more extensive dataset that includes details on bond payments, such as interest rates and amounts. Investors can access this data to research each payment made on the bond.