Stocks
JPMorgan Issues 5.6% Coupon Bond Due in 2038
JPMorgan Chase & Co. has issued a corporate bond with a coupon rate of 5.60%. The JPM6481661 bond is set to mature on August 13, 2038.
The next payment for this bond is scheduled for August 16, 2027. This payment will be made in accordance with the standard coupon payout schedule for corporate bonds.
The credit rating for JPMorgan Chase & Co. has not been mentioned in the provided source, but it is worth noting that a higher credit rating can lead to lower interest rates on bond issuances.