Stocks
JPMorgan Issues Bond with 6.40% Coupon Rate
JPMorgan Chase & Co. has issued a bond with significant terms that will affect investors and the company's financials for decades to come.
The JPM6496993 Bond Profile reveals key metrics about the bond, including its issue date of August 31, 2026, and maturity date of August 31, 2056. The face value is $1,000.00 USD, with a minimum denomination of $1,000.00 USD.
The bond has a coupon rate of 6.40%, which means that the company will pay investors an annual interest of 6.40% on their investment. This rate is crucial for investors to understand the potential return on their investment in this bond.