Mitsubishi Materials Advances High-Temperature Oxygen-Free Copper Technology
Mitsubishi Materials Corporation has developed a new high-performance oxygen-free copper grade called MOFC-GC, designed to maintain a fine, uniform structure even at temperatures up to 1,000°C. This innovation targets active metal brazing substrates used in power modules, where the demand for electrical conductivity, heat dissipation, and processing reliability is growing due to the rise of xEV electrification and renewable-energy systems. The launch highlights a market shift toward higher-value oxygen-free copper grades engineered for challenging thermal and electrical environments.
The development opens new opportunities for suppliers serving power semiconductors, EV components, advanced electronics, and next-generation energy systems. Mitsubishi Materials is expanding its MOFC portfolio, while Furukawa Electric is developing heat-resistant oxygen-free copper for power semiconductor modules. Furukawa's TOFCTM combines high thermal conductivity with a lower Young's modulus, designed to maintain stiffness above 300°C while reducing deformation and bonding interface stress. These advancements emphasize material engineering, purity, heat resistance, and customer qualification over commodity copper volume.
According to DataM Intelligence, the global Oxygen-Free Copper market was valued at $32.60 billion in 2025 and is projected to reach $50.04 billion by 2033, growing at a 5.51% CAGR during 2026-2033. The Asia-Pacific region is identified as the dominating and fastest-growing market, driven by electronics manufacturing, semiconductor production, EV supply chains, renewable-energy investment, and advanced electrical infrastructure. China is the largest market within Asia-Pacific, while India represents an emerging opportunity through electronics manufacturing, semiconductor and EV initiatives, renewable energy infrastructure, and telecommunications investment.
Recent developments include Furukawa Electric's expansion of its high-performance oxygen-free copper portfolio, the U.S. Department of Energy's $1.9 billion funding for grid upgrades, and Mitsubishi Materials' introduction of a multi-gauge strip version of MOFC-HR. These advancements underscore the growing importance of high-performance oxygen-free copper grades in various high-demand applications.