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MACOM Technology Unveils High-Performance 3.2T Chipset

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TIA OM
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MACOM Technology made headlines on September 17 as it launched a high-performance 3.2T chipset aimed at artificial intelligence infrastructure, cloud data centers, and high-speed networks.

The company's new solution features an 8-channel, 448Gbps PAM-4 architecture that achieves up to 3.2T throughput and integrates TIA, photodiodes, and a previously launched 448Gbps PAM-4 driver.

Additionally, MACOM provided key transceiver modules with the solution, boasting receiver photodiode bandwidth exceeding 100GHz.

The company's main business is high-performance analog, digital, and optical semiconductor products, serving markets such as data centers, communications, and over 6,000 end customers.

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