Broadcom Banks on Wall Street to Fuel AI Infrastructure Growth
Broadcom is looking to Wall Street for help in expanding the AI infrastructure market. The chipmaker is preparing a $60 billion financing plan that could help companies like Anthropic PBC acquire chips and other computing infrastructure, supporting demand for Broadcom's data-center products.
The structure of the potential package involves a $42 billion Class A senior-secured tranche and an $18 billion Class B junior-debt tranche led by Blackstone Inc. The financing plan aims to give Anthropic and other AI companies access to additional computing capacity while Broadcom seeks to sell more chips and data-center equipment, competing with NVIDIA Corp.
AI investment is increasingly moving into credit markets, pushing beyond corporate cash flow. According to UBP estimates, Microsoft Corp., Amazon.com Inc., Alphabet Inc., Meta Platforms Inc., and Oracle Corp. will spend roughly $820 billion on capital expenditures in 2026, versus about $750 billion in operating cash flow.
The trend leaves AI financing tied increasingly to the value of chips, data centers, and future cash flows. Broadcom's expanding capital network could help customers fund infrastructure purchases while widening the addressable market for its AI hardware.