JPMorgan Chase & Co. Issues New Bond with 6.10% Coupon Rate
JPMorgan Chase & Co., a financial holding company, has issued a new bond with significant key metrics. The JPM6518861 Bond Profile details that the issue date is September 23, 2026, and it matures on September 23, 2041. This bond comes with a face value of $1,000 USD and a minimum denomination of $1,000 USD.
The coupon rate for this bond is 6.10%, which is the interest rate paid periodically to the bondholders. JPMorgan Chase & Co. engages in various financial services, including investment banking, consumer and commercial banking, asset management, and more. The company operates through segments such as Consumer and Community Banking, Commercial and Investment Bank, Asset and Wealth Management, and Corporate.
The issuance of this new bond is a significant development for JPMorgan Chase & Co., reflecting its ongoing efforts to manage its financial operations and provide services to clients.