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JPMorgan Chase Issues 5.75% Bond Maturing in 2033

Guavy AI Editorial Team Published September 24, 2026

Instruments

JPM

JPMorgan Chase & Co. has issued a bond with the ticker JPM6518854, offering a 5.75% interest rate maturing on September 23, 2033.

The bond's credit rating is not mentioned in the source, but it is listed under FINRA.

According to the bond redemption profile, the principal and accrued interest will be repaid in full upon maturity.

A sinking fund schedule may impact decisions regarding early redemption of callable bonds with sinking funds.

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