Stocks
JPMorgan Chase Issues JPM6511050 Bond with 5.60% Coupon Payment
JPMorgan Chase & Co., a financial holding company, issued a bond called JPM6511050. The bond has an issue date of September 14, 2026 and matures on September 12, 2036. It has a face value of $1,000 and minimum denomination is also $1,000.
The bond offers a coupon payment of 5.60% per annum, paid semi-annually. The first coupon payment date is September 14, 2026, with subsequent payments on March 14 and September 14 every year. The total amount of the first coupon payment will be $27.69.
The bond's redemption profile includes information about its issuer credit risk, which is assessed as senior in the USA, indicating a low credit risk. The company uses a sinking fund to repay investors, with the next call date set for September 12, 2036.