JPMorgan Issues Bond with Notable Coupon Rate and Maturity Date

JPMorgan Chase & Co., a financial holding company, has issued a bond with some notable characteristics. The JPM6496984 Bond Profile lists key metrics such as its issuer, issue date, maturity date, face value, minimum denomination, and coupon rate.

The bond's details show that it was issued by JPMorgan Chase & Co., has an issue date of August 31, 2026, and matures on August 31, 2033. The bond has a face value of $1,000 USD and a minimum denomination of $1,000 USDC.

The coupon rate for the bond is 5.35%, which reflects the interest paid to investors who hold the bond until maturity. JPMorgan Chase & Co.'s business segments include Consumer and Community Banking (CCB), Commercial and Investment Bank (CIB), Asset and Wealth Management (AWM), and Corporate, all of which contribute to the company's overall financial operations.