JPMorgan Issues Medium-Term Bond with 5.20% Coupon Rate
JPMorgan Chase & Co., a financial holding company founded in 1799 and headquartered in New York, NY, has issued a bond with the identifier JPM6509056. The issue date for this bond is September 14, 2026, and it matures on September 14, 2033.
The face value of the bond is $1,000 USD, and the minimum denomination is also $1,000 USD. The issuer focuses on investment banking, financial services for consumers and small businesses, commercial banking, financial transaction processing, and asset management through its segments: Consumer and Community Banking (CCB), Commercial and Investment Bank (CIB), Asset and Wealth Management (AWM), and Corporate.
The bond has a coupon rate of 5.20% with an annual frequency. The next coupon payment is scheduled for September 14, 2032, with the interest rate remaining at 5.20%. The outstanding amount of this bond is $1 million USD.