JPMorgan Issues New Bond with 5.28% Coupon Rate
JPMorgan Chase & Co., a financial holding company, has issued a bond named JPM6496981. The key metrics for this bond include an issue date of August 31, 2026, and a maturity date of February 28, 2035.
The face value of the bond is $1,000.00 USD, with a minimum denomination of $1,000.00 USD. The coupon rate for JPM6496981 is 5.28%.