Kools' Breakthrough Tech Tames Warpage in Massive Chip Packages
Kools has developed bonding technology to suppress warpage in ultra-large semiconductor packages. The company's innovation uses a high-stiffness lid to control package warpage and its proprietary Thermal Clutch to shorten heating and cooling times. This technology is designed to prevent bonding defects in large packages, such as Nvidia's next-generation AI accelerator Rubin Ultra.
Kools' CEO Cho Jin-hyun explained that conventional thermocompression bonding (TCB) requires more than one minute to heat and cool an ultra-large 180×70mm package. However, the Thermal Clutch can reduce this time to less than 10 seconds. By maintaining the package shape with a high-stiffness lid while shortening bonding time, Kools aims to secure productivity for ultra-large packages.
The company's technology addresses the challenges of large-area TCB processes, which become less productive as the bonding area increases. High thermal output and warpage control are key issues in these processes. Kools proposes restraining the package with a high-stiffness lid and shortening heating and cooling times using its Thermal Clutch.