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Nvidia's Glass Packaging Push Could Reshape AI Chip Design
Nvidia's next leap in AI performance may not come from its GPU itself, but rather from the material holding it together.
The company is exploring glass packaging to build larger AI chip packages with denser connections and room for more high-bandwidth memory.
Rising HBM prices increase the economic stakes of every packaging decision.
SCHMID, a company supplying equipment to manufacturers developing glass-core substrates, sees this as a significant change for companies that make packaging equipment and substrates, as well as implications for memory suppliers like Micron.