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JPMorgan Chase Bond Issue JPM6182349 Details Interest Rate and Redemption Date

Guavy AI Editorial Team
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JPM
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A bond issued by JPMorgan Chase & Co., known as JPM6182349, has an interest rate of 5.6% and is scheduled for redemption on September 22, 2045. According to data from TradingView, the next payment will be made on September 23, 2026.

The bond's coupon rate is fixed at 5.6%, with annual payments of $56.00. The accrual dates are spaced one year apart, starting from February 25, 2023.

As of the data available, there is no mention of any credit rating or risk assessment for this specific bond issue.

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