JPMorgan Chase Bond Offering JPM6518874 Offers 6.25% Coupon Rate
JPMorgan Chase & Co.'s bond offering JPM6518874 has a coupon rate of 6.25%. This means that investors holding this bond will receive an annual interest payment of 6.25% on their investment.
The next scheduled payment for this bond is set to take place on March 23, 2027. The payment frequency and accrual date are not specified in the provided information.