JPMorgan Chase Bond with 4.5% Coupon Rate Matures in 2030
JPMorgan Chase & Co.'s bond offering JPM6155056 has a coupon rate of 4.5% and a maturity date of August 21, 2030.
The next interest payment is scheduled for August 21, 2026, according to the trading platform TradingView.
No other details about the bond's performance or market trends are provided in the source.