JPMorgan Chase & Co. Corporate Bond JPM5747324 Redeemable Through Call Starting January 1, 2023

The JPM5747324 corporate bond issued by JPMorgan Chase & Co. has a redemption profile that reveals key details about its repayment schedule. The bond, with a coupon rate of 5.5% and a maturity date of February 15, 2036, is callable at par value of $100.

According to the TradingView data, the next call date for the bond is January 1, 2023, and the issuer has issued a notice of five days before redemption. The outstanding amount of the bond stands at $9.268 million as of the last update.

The JPM5747324 bond's redemption schedule shows that it has been redeemed through call several times in the past, with each redemption occurring at par value without any accrued interest.