JPMorgan Chase & Co., one of the largest financial institutions in the world, has issued a corporate bond with a coupon rate of 5.0% maturing on September 20, 2030.
The bond, identified as JPM6518857, is listed on FINRA and carries a credit rating that is not specified in the source.
The next payment for this bond is scheduled to take place on September 20, 2027, and will be based on the current coupon rate of 5.0%.
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