JPMorgan Chase Issues 6.0% Corporate Bond with 2028 Maturity

JPMorgan Chase & Co., one of the largest financial institutions in the world, has issued a corporate bond with an interest rate of 6.0% and a maturity date of November 30, 2028.

The bond, known as JPM5706906, is listed on FINRA (Financial Industry Regulatory Authority) and has no trades recorded thus far.

According to the bond's profile, the next interest payment is scheduled for November 30, 2026. The coupon rate of 6.0% represents the nominal yield on the bond, indicating the annual interest earned by investors who hold the bond.