JPMorgan Chase Issues Corporate Bond with 4.85% Coupon Rate

JPMorgan Chase & Co. has issued a corporate bond with a coupon rate of 4.85%. The bond, identified as JPM6165767, is due on March 9, 2034.

The current interest payment overview shows that the next payment is scheduled for September 9, 2026. According to TradingView's data, the bond pays an annual coupon of $48.5 with a frequency of every 365 days, except for one payment which will occur after 181 days.

FINRA has listed JPM6165767 as a corporate bond on their platform, with a current price not specified in the source. The bond's ratings from various sources are also mentioned, but no specific figures or details are provided.